Deep Reactive Ion Etching of Quartz, Lithium Niobate and Lead Titanate
نویسندگان
چکیده
High speed directional etching of non conventional materials like Quartz, Lithium Niobate and Lead Titanate is still insufficiently developed for producing high aspect ratio microstructures. Compared to deep silicon etching, the plasma etching of these materials has suffered from limitations in achievable depth, aspect ratio, verticality and smoothness of surfaces. Deep etching with nearly vertical walls was successfully demonstrated for all three materials.
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